Field Programmable Gate Array (FPGA) with 128,000 logic cells and 160,000 registers, built on 40nm process technology. Features 9504 Kbit RAM, 480 dedicated DSP multipliers (25x18), and 16 transceiver blocks operating at up to 3.75 Gbps. This surface-mount device is housed in a 484-pin Flip Chip Ball Grid Array (FCBGA) package measuring 23mm x 23mm. Offers 240 maximum user I/Os, 1 Ethernet MAC, and 2 PCI blocks, with an operating temperature range of 0°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX130T-2FF484C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
484
PCB
484
Package Length (mm)
23
Package Width (mm)
23
Package Height (mm)
2.4(Max)
Seated Plane Height (mm)
3(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
Virtex®-6 CXT
Maximum Number of User I/Os
240
Number of Registers
160000
RAM Bits
9504Kbit
Device Logic Cells
128000
Process Technology
40nm
Ethernet MACs
1
Number of Multipliers
480 (25x18)
Programmability
Yes
Transceiver Blocks
16
Transceiver Speed
3.75Gbps
Program Memory Type
Flash
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
480
PCI Blocks
2
Speed Grade
2
Total Number of Block RAM
264
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6VCX130T-2FF484C Datasheet
Download the complete datasheet for Xilinx XC6VCX130T-2FF484C to view detailed technical specifications.
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