Field Programmable Gate Array (FPGA) with 128,000 logic cells and 160,000 registers, built on 40nm process technology. Features 9.5 Mbit of RAM, 480 dedicated DSP slices with 25x18 multipliers, and 16 transceiver blocks operating at up to 3.75 Gbps. This 784-pin FCBGA package, measuring 29x29mm with a maximum height of 2.5mm, supports surface mounting and offers 400 user I/Os. Operates within a temperature range of 0°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX130T-2FF784C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
784
PCB
784
Package Length (mm)
29
Package Width (mm)
29
Package Height (mm)
2.5(Max)
Seated Plane Height (mm)
3.1(Max)
Package Material
Plastic
Mounting
Surface Mount
Family Name
Virtex®-6 CXT
Maximum Number of User I/Os
400
Number of Registers
160000
RAM Bits
9504Kbit
Device Logic Cells
128000
Process Technology
40nm
Ethernet MACs
1
Number of Multipliers
480 (25x18)
Programmability
Yes
Transceiver Blocks
16
Transceiver Speed
3.75Gbps
Program Memory Type
Flash
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
480
PCI Blocks
2
Speed Grade
2
Total Number of Block RAM
264
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6VCX130T-2FF784C Datasheet
Download the complete datasheet for Xilinx XC6VCX130T-2FF784C to view detailed technical specifications.
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