Field Programmable Gate Array (FPGA) with 128,000 logic cells and 160,000 registers, built on 40nm process technology. Features 9504 Kbit RAM, 480 dedicated DSP slices, and 16 transceiver blocks. Offers 600 maximum user I/Os and a 1156-pin Flip Chip Ball Grid Array (FCBGA) package for surface mounting. Operates within a temperature range of 0°C to 85°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX130T-2FFG1156C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1156 |
| PCB | 1156 |
| Package Length (mm) | 35 |
| Package Width (mm) | 35 |
| Package Height (mm) | 2.9(Max) |
| Seated Plane Height (mm) | 3.5(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Virtex®-6 CXT |
| Maximum Number of User I/Os | 600 |
| Number of Registers | 160000 |
| RAM Bits | 9504Kbit |
| Device Logic Cells | 128000 |
| Process Technology | 40nm |
| Ethernet MACs | 1 |
| Number of Multipliers | 480 (25x18) |
| Programmability | Yes |
| Transceiver Blocks | 16 |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 480 |
| PCI Blocks | 2 |
| Speed Grade | 2 |
| Total Number of Block RAM | 264 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6VCX130T-2FFG1156C Datasheet
Download the complete datasheet for Xilinx XC6VCX130T-2FFG1156C to view detailed technical specifications.
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