Field Programmable Gate Array (FPGA) with 241,152 logic cells and 301,440 registers. Features 14,976 Kbit RAM, 768 dedicated DSP slices, and 768 multipliers (25x18). Includes 16 transceiver blocks operating at 3.75 Gbps and 2 PCI blocks. Packaged in a 784-pin FCBGA (Flip Chip Ball Grid Array) with a 29mm x 29mm footprint, designed for surface mounting. Operates within a 0°C to 85°C temperature range.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX240T-2FFG784C technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 784 |
| PCB | 784 |
| Package Length (mm) | 29 |
| Package Width (mm) | 29 |
| Package Height (mm) | 2.5(Max) |
| Seated Plane Height (mm) | 3.1(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Virtex®-6 CXT |
| Maximum Number of User I/Os | 400 |
| Number of Registers | 301440 |
| RAM Bits | 14976Kbit |
| Device Logic Cells | 241152 |
| Process Technology | 40nm |
| Ethernet MACs | 1 |
| Number of Multipliers | 768 (25x18) |
| Programmability | Yes |
| Transceiver Blocks | 16 |
| Transceiver Speed | 3.75Gbps |
| Program Memory Type | Flash |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 85°C |
| Dedicated DSP | 768 |
| PCI Blocks | 2 |
| Speed Grade | 2 |
| Total Number of Block RAM | 416 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6VCX240T-2FFG784C Datasheet
Download the complete datasheet for Xilinx XC6VCX240T-2FFG784C to view detailed technical specifications.
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