Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology. Features 5,616 Kbit RAM, 288 multipliers (25x18), 12 transceiver blocks operating at 3.75 Gbps, and 1 Ethernet MAC. This surface-mount device is housed in a 784-pin Flip Chip Ball Grid Array (FCBGA) package measuring 29mm x 29mm, with a maximum seated plane height of 3.1mm. Operates across a temperature range of -40°C to 100°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX75T-2FF784I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Flip Chip Ball Grid Array
Lead Shape
Ball
Pin Count
784
PCB
784
Package Length (mm)
29
Package Width (mm)
29
Package Height (mm)
2.5(Max)
Seated Plane Height (mm)
3.1(Max)
Package Material
Plastic
Mounting
Surface Mount
Family Name
Virtex®-6 CXT
Maximum Number of User I/Os
360
Number of Registers
93120
RAM Bits
5616Kbit
Device Logic Cells
74496
Process Technology
40nm
Ethernet MACs
1
Number of Multipliers
288 (25x18)
Programmability
Yes
Transceiver Blocks
12
Transceiver Speed
3.75Gbps
Program Memory Type
Flash
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
288
PCI Blocks
1
Speed Grade
2
Total Number of Block RAM
156
Compliance
Cage Code
68994
EU RoHS
No
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC6VCX75T-2FF784I Datasheet
Download the complete datasheet for Xilinx XC6VCX75T-2FF784I to view detailed technical specifications.
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