Field Programmable Gate Array (FPGA) with 74,496 logic cells and 93,120 registers, built on 40nm process technology. Features 5.616 Mbit of RAM, 288 dedicated DSP slices, and 156 block RAMs. Includes 1 Ethernet MAC, 1 PCI block, and 12 transceiver blocks operating at up to 3.75 Gbps. Packaged in a 484-pin Flip Chip Ball Grid Array (FCBGA) for surface mounting, with a pin pitch of 1mm. Operates across a temperature range of -40°C to 100°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC6VCX75T-2FFG484I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 484 |
| PCB | 484 |
| Package Length (mm) | 23 |
| Package Width (mm) | 23 |
| Package Height (mm) | 1.7 |
| Seated Plane Height (mm) | 2.2 |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Virtex®-6 CXT |
| Maximum Number of User I/Os | 240 |
| Number of Registers | 93120 |
| RAM Bits | 5616Kbit |
| Device Logic Cells | 74496 |
| Process Technology | 40nm |
| Ethernet MACs | 1 |
| Number of Multipliers | 288 (25x18) |
| Programmability | Yes |
| Transceiver Blocks | 12 |
| Transceiver Speed | 3.75Gbps |
| Program Memory Type | Flash |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 288 |
| PCI Blocks | 1 |
| Speed Grade | 2 |
| Total Number of Block RAM | 156 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC6VCX75T-2FFG484I Datasheet
Download the complete datasheet for Xilinx XC6VCX75T-2FFG484I to view detailed technical specifications.
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