Field Programmable Gate Array (FPGA) with 125,000 logic cells and 157,200 registers, built on 28nm process technology. Features 1060 Kbit RAM, 400 DSP slices, and 2 Ethernet MACs. Operates within a 0°C to 100°C temperature range. This surface-mount device is housed in a 676-pin Fine Pitch Ball Grid Array (FCBGA) package measuring 27mm x 27mm with a 1mm pin pitch. Supports differential I/O standards including LVDS, SSTL, and HSTL.
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Xilinx XC7Z030-3FFG676E technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 2.4(Max) |
| Seated Plane Height (mm) | 3(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-034AAL-1 |
| Family Name | Kintex-7 |
| Maximum Number of User I/Os | 128 |
| Number of Registers | 157200 |
| RAM Bits | 1060Kbit |
| Device Logic Cells | 125000 |
| Process Technology | 28nm |
| Ethernet MACs | 2 |
| Number of Multipliers | 400 (18x25) |
| Programmability | Yes |
| Program Memory Type | SRAM |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 400 |
| Speed Grade | 3 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
| Device Number of DLLs/PLLs | 5 |
| Total Number of Block RAM | 265 |
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
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