Field Programmable Gate Array (FPGA) with 350,000 logic cells and 437,200 registers, built on 28nm process technology. Features 2180 Kbit RAM, 900 dedicated DSP slices, and 900 multipliers (18x25). Offers 128 maximum user I/Os and 2 Ethernet MACs. Packaged in a 676-pin Lidless FCBGA (Flip Chip Ball Grid Array) with a 27mm x 27mm footprint, suitable for surface mounting. Operates within a 0°C to 85°C temperature range.
PackageLidless FCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC7Z045-1FBG676C technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
Lidless FCBGA
Package/Case
Lidless FCBGA
Package Description
Flip Chip Lidless Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.84
Seated Plane Height (mm)
2.34
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
Kintex-7
Maximum Number of User I/Os
128
Number of Registers
437200
RAM Bits
2180Kbit
Device Logic Cells
350000
Process Technology
28nm
Ethernet MACs
2
Number of Multipliers
900 (18x25)
Programmability
Yes
Program Memory Type
SRAM
Min Operating Temperature
0°C
Max Operating Temperature
85°C
Dedicated DSP
900
Speed Grade
1
Differential I/O Standards Supported
LVDS|SSTL|HSTL
Device Number of DLLs/PLLs
8
Total Number of Block RAM
545
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC7Z045-1FBG676C Datasheet
Download the complete datasheet for Xilinx XC7Z045-1FBG676C to view detailed technical specifications.
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