Field Programmable Gate Array (FPGA) with 350,000 logic cells and 437,200 registers, built on 28nm process technology. Features 2180 Kbit RAM, 900 multipliers (18x25), and 900 dedicated DSP slices. Offers 128 maximum user I/Os and 8 DLLs/PLLs. Housed in a 676-pin Fine Pitch Ball Grid Array (FCBGA) package, measuring 27x27mm with a 1mm pin pitch, suitable for surface mounting. Operates across an automotive temperature range of -40°C to 100°C.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC7Z045-1FFG676I technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
FCBGA
Package Description
Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
676
PCB
676
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
2.4(Max)
Seated Plane Height (mm)
3(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034AAL-1
Family Name
Kintex-7
Maximum Number of User I/Os
128
Number of Registers
437200
RAM Bits
2180Kbit
Device Logic Cells
350000
Process Technology
28nm
Ethernet MACs
2
Number of Multipliers
900 (18x25)
Programmability
Yes
Program Memory Type
SRAM
Min Operating Temperature
-40°C
Max Operating Temperature
100°C
Dedicated DSP
900
Speed Grade
1
Differential I/O Standards Supported
LVDS|SSTL|HSTL
Device Number of DLLs/PLLs
8
Total Number of Block RAM
545
Compliance
Cage Code
68994
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
3A991.d
Automotive
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Xilinx XC7Z045-1FFG676I Datasheet
Download the complete datasheet for Xilinx XC7Z045-1FFG676I to view detailed technical specifications.
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