Field-Programmable Gate Array (FPGA) with 350,000 logic cells and 437,200 registers, built on 28nm process technology. Features 2180 Kbit RAM, 900 multipliers (18x25), and 900 dedicated DSP slices. Offers 128 maximum user I/Os and 2 Ethernet MACs. Operates within a -40°C to 100°C temperature range. Packaged in a 676-pin FCBGA (Flip Chip Ball Grid Array) with a 27mm x 27mm footprint, suitable for surface mounting.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Xilinx XC7Z045-2FFG676I technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 27 |
| Package Width (mm) | 27 |
| Package Height (mm) | 2.4(Max) |
| Seated Plane Height (mm) | 3(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Package Orientation | Yes |
| Package Orientation Marking Type | Dot |
| Jedec | MS-034AAL-1 |
| Family Name | Kintex-7 |
| Maximum Number of User I/Os | 128 |
| Number of Registers | 437200 |
| RAM Bits | 2180Kbit |
| Device Logic Cells | 350000 |
| Process Technology | 28nm |
| Ethernet MACs | 2 |
| Number of Multipliers | 900 (18x25) |
| Programmability | Yes |
| Program Memory Type | SRAM |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 100°C |
| Dedicated DSP | 900 |
| Speed Grade | 2 |
| Differential I/O Standards Supported | LVDS|SSTL|HSTL |
| Device Number of DLLs/PLLs | 8 |
| Total Number of Block RAM | 545 |
Compliance
| Cage Code | 68994 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | 3A991.d |
| Automotive | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
Xilinx XC7Z045-2FFG676I Datasheet
Download the complete datasheet for Xilinx XC7Z045-2FFG676I to view detailed technical specifications.
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