Mobile application processor integrates a quad-core 64-bit ARM Cortex-A53 CPU with ARMv8 support and NEON SIMD acceleration. The SoC includes a Mali-400MP2 GPU, hardware video decode up to H.265 4K at 30 fps, and H.264 encoding up to 1080p at 60 fps. Display interfaces support 4-lane MIPI DSI and RGB panels up to 1920 by 1200 at 60 fps, LVDS up to 1366 by 768 at 60 fps, and HDMI 1.4 up to 4K at 30 fps. External memory support includes DDR2, DDR3, DDR3L, LPDDR2, and LPDDR3 SDRAM with up to 3 GB address space. The device is offered in a 396-ball FBGA package with 0.65 mm ball pitch and a 15 mm by 15 mm body.
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| CPU core | Quad-core ARM Cortex-A53 |
| CPU architecture | ARMv8, 64-bit and 32-bit execution states |
| L1 instruction cache | 32KB |
| L1 data cache | 32KB |
| L2 cache | 512KB |
| GPU | ARM Mali-400MP2 |
| Graphics API support | OpenGL ES 2.0, OpenVG 1.1 |
| SDRAM types | DDR2, DDR3, DDR3L, LPDDR2, LPDDR3 |
| SDRAM clock frequency | Up to 667MHz |
| SDRAM address space | Up to 3GB |
| SDRAM bus width | 32bit |
| Video decode H.265 | 4K at 30 fps, 1080p at 120 fps |
| Video decode H.264 | 1080p at 60 fps |
| Video encode H.264 | 1080p at 60 fps |
| MIPI DSI display output | 4 lanes, up to 1920x1200 at 60 fps |
| HDMI output | HDMI 1.4 with HDCP 1.2, up to 4K at 30 fps |
| USB interfaces | USB 2.0 OTG high-speed with PHY; USB host with PHY/HSIC |
| Ethernet MAC | 10/100/1000Mbps |
| Ambient operating temperature | -20 to +70°C |
| Package body size | 15 x 15mm |
| Ball pitch | 0.65mm |
| Package ball count | 396balls |
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