| Image | Part Number | Manufacturer | Description |
|---|---|---|---|
No Image | H65-175MP | Epoxy Technology | Single Component, Alumina-Filled Epoxy For Military Hybrid Die and Component Attach |
No Image | H35-175MP | Epoxy Technology | Single Component, Silver-Filled Epoxy For Military Hybrid Die and Component Attach |
No Image | E3001-HV | Epoxy Technology | Snap Cure, Single Component, Silver-Filled Die Attach Adhesive For Semiconductor Plastic Ic Packaging |
No Image | TJ1183-LH | Epoxy Technology | A Single Component, Low-Halogen, Electrically Insulating Die Attach Adhesive with Extended Pot Life |
No Image | 773437 | Henkel | ADHESIVE-DIE ATTACH PASTE SILVER IS USED FOR COMPONENT OR DIE ATTACH WHERE VERY HIGH ELECTRICAL AND THERMAL CONDUCTIVITY ARE REQUIRED |
No Image | EK1000 | Epoxy Technology | Silver-Filled Adhesive That Exhibits Exceptional Thermal and Electrical Conductivity Along with A Shiny Silver Appearance Designed For The Demanding Requirements Of High Power Led Die Attach Applications |
No Image | 84-1LMINB1 | Henkel | Die Attach Adhesive Is Formulated To Bond Difficult-To-Wet Surfaces |
No Image | INDIUM9.52 | Indium | DIE ATTACH SOLDER PASTE |
No Image | INDIUM9.32 | Indium | DIE ATTACH SOLDER PASTE |
No Image | AFN601 | Furukawa Electric | DIE Attach Film, high polymer material |
No Image | 8352L | Henkel | DIE Attach Silver PASTE |
No Image | DT-UV1200-SE4 | Orion | Dicing Die Attach Film Adhesives |
No Image | ESP7660-HK-DAF | Orion | Dicing Die Attach Film Adhesives |
No Image | 2000 | Henkel | DIE Attach Pastes For Wirebond Laminate Packaging |
No Image | CT262M | Kyocera | DIE Attach, High Thermal Conductive Paste |
No Image | AFN303 | Furukawa Electric | DIE Attach Film, high polymer material |
No Image | INDIUM9.72 | Indium | DIE Attach Solder Paste |
No Image | ATB 120U | Henkel | DIE Attach Film, Transparent |
No Image | AFN301 | Furukawa Electric | DIE Attach Film, high polymer material |
