Skip to main content
Datasheets.com
Product Change NoticeMicrochip

Microchip Qualification Plan Summary: CuPdAu Bond Wire for SST49LF008A and SST49LF080A

Qualification plan for CuPdAu bond wire material for Microchip SST49LF008A and SST49LF080A devices in 32L PLCC packages at the MMT assembly site.

View product change notice

Overview

This qualification plan summary (PCN MAAN-05CKPE326) outlines the qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for specific Microchip flash memory products. The change affects SST49LF008A and SST49LF080A variants in 32-lead PLCC (11.5x14x3.37mm) packaging. The document details assembly materials including QMI519 die attach and G600V molding compound, alongside a reliability testing schedule featuring HAST, UHAST, Temperature Cycling, and High Temperature Storage Life (HTSL) tests per JESD22 standards.

Use Cases

  • Verification of material changes in Microchip flash memory components
  • Reviewing reliability qualification standards for PLCC packages
  • Tracking assembly site material updates for supply chain management

Topics

Microchip
SST49LF008A
SST49LF080A
CuPdAu
bond wire
32L PLCC
MMT assembly site
qualification plan
PCN
flash memory
reliability testing
HAST

Referenced Parts

SST49LF008A-33-4C-NHE

Microchip

Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for SST49LF008A-33-4C-NHE

SST49LF008A-33-4C-NHE-T

Microchip

SST49LF008A-33-4C-NHE-T, SST49LF080A-33-4C-NHE and SST49LF080A-33-4C-NHE-T available in 32L PLCC

SST49LF080A-33-4C-NHE

Microchip

SST49LF008A-33-4C-NHE-T, SST49LF080A-33-4C-NHE and SST49LF080A-33-4C-NHE-T available in 32L PLCC

SST49LF080A-33-4C-NHE-T

Microchip

SST49LF008A-33-4C-NHE-T, SST49LF080A-33-4C-NHE and SST49LF080A-33-4C-NHE-T available in 32L PLCC

11.5x14x3.37

Microchip

11.5x14x3.37 mm

11.5x14x3.37mm

Microchip

(11.5x14x3.37mm) package at MMT assembly site.

11.5x14x3.37mm

Microchip

T available in 32L PLCC (11.5x14x3.37mm) package at MMT assembly site.

245C

Microchip

MSL 3 @ 245C

32L

Microchip

SST49LF080A-33-4C-NHE-T available in 32L PLCC

32L

Microchip

T available in 32L PLCC (11.5x14x3.37mm) package at MMT assembly site.

33-4C-NHE-T

Microchip

33-4C-NHE-T, SST49LF080A-33-4C-NHE and SST49LF080A-33-4C-NHE-

70C

Microchip

Electrical test pre and post stress at +25C, 70C

70C

Microchip

Electrical test pre and post stress at 70C temp.; 3

B100

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5

B108

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5

CDF-AEC-Q100-001

Microchip

Wire Bond Shear - WBS CDF-AEC-Q100-001 5 0 1 5 0 5 30 bonds from a min. 5 devices.

G600V

Microchip

MC G600V

JESD22

Microchip

Physical Dimensions Measure per JESD22 B100 and B108 10 0 3 30 0 5

JESD22-A103.

Microchip

HTSL (High Temp Storage Life) JESD22-A103. 150°C for 1008 hrs.

JESD22-A104.

Microchip

Temp Cycle JESD22-A104. -65°C to +150°C for 500 cycles.

JESD22-A110.

Microchip

HAST JESD22-A110. +130°C/85% RH for 96 hours

JESD22-A113.

Microchip

JESD22-A113. +150°C Bake for 24 hours, moisture

JESD22-A118.

Microchip

UHAST JESD22-A118. +130°C/85% RH for 96 hrs or

Jedec-STD-020E

Microchip

peak reflow temperature per Jedec-STD-020E for

MAAN-05CKPE326

Microchip

PCN #: MAAN-05CKPE326

QMI519

Microchip

QMI519 (PFAS-free)

SST49LF008A-

Microchip

additional bond wire material for SST49LF008A-33-4C-NHE, SST49LF008A-

Microchip Qualification Plan Summary: CuPdAu Bond Wire for SST49LF008A and SST49LF080A | Design Resources