SOT-23 surface-mount package outline defines a small molded plastic semiconductor package. The package uses matte-tin plated leads solderable per MIL-STD-202 Method 208 and has UL 94V-0 flammability-rated case material. The mechanical outline lists dimensions in millimeters, with typical body dimensions including 2.40 mm for dimension C and 2.90 mm for dimension H. Tape-and-reel packaging information is defined for 8 mm carrier tape with suffix-dependent minimum packing quantities.
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| Package style | SOT23 |
| Mounting type | Surface mount |
| Approximate package mass | 0.008g |
| Case material | Molded plastic, UL 94V-0 |
| Terminal finish | Matte tin plated leads |
| Solderability standard | MIL-STD-202 Method 208 |
| Dimension A | 0.37 min, 0.51 max, 0.40 typmm |
| Dimension B | 1.20 min, 1.40 max, 1.30 typmm |
| Dimension C | 2.30 min, 2.50 max, 2.40 typmm |
| Dimension H | 2.80 min, 3.00 max, 2.90 typmm |
| Suggested pad layout C | 2.0mm |
| Suggested pad layout X | 0.8mm |
| Suggested pad layout Y1 | 2.9mm |
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