HEAT SINK
PLCC SOCKET, 68 POSITION, THROUGH HOLE; Convert From:68-PLCC; Convert To:68-PLCC; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; Connector Type:PLCC Socket; No. of Contacts:68; No. of Positions:68 ;RoHS Compliant: No
IC Socket Test Clip
PLCC SOCKET, 32 POSITION, THROUGH HOLE; Convert From:32-PLCC; Convert To:32-PLCC; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; Connector Type:PLCC Socket; No. of Contacts:32; No. of Positions:32 ;RoHS Compliant: No
HEAT SINK
HEAT SINK
IC ADAPTER, 8-SOIC TO 8-DIP; Convert From:8-SOIC; Convert To:8-DIP; Pitch Spacing:2.54mm; Row Pitch:7.62mm; Product Range:-; No. of Contacts:8; No. of Positions:8 ;RoHS Compliant: No
TEST CLIP KIT, 56 POSITION; Convert From:-; Convert To:-; Pitch Spacing:-; Row Pitch:-; Product Range:-; Contact Plating:Gold Plated Contacts; Kit Contents:TSOP Clips; No. of Contacts:56 ;RoHS Compliant: No
CHIP QUIK REMOVAL ALLOY, 32FT; Braid Material:-; Width:-; Length:32ft; Accessory Type:Removal Alloy, No Lead; For Use With:Desoldering ;RoHS Compliant: Yes
RIBBON CABLE, MICTOR PLG 38WAY 0.229M BLK - More Details
PLCC SOCKET, 84 POSITION, THROUGH HOLE; Convert From:84-PLCC; Convert To:84-PLCC; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; Connector Type:PLCC Socket; No. of Contacts:84; No. of Positions:84 ;RoHS Compliant: No
SOCKET ADAPTER, 44 POSITION, THROUGH HOLE; Convert From:44-PLCC; Convert To:44-PLCC; Pitch Spacing:1.27mm; Row Pitch:-; Product Range:-; No. of Contacts:44; No. of Positions:44 ;RoHS Compliant: No
BGA SOCKET, 388 POSITION, SMD; Product Range:-; Connector Type:BGA Socket; No. of Contacts:388; Pitch Spacing:1.27mm; Row Pitch:1.27mm; Contact Plating:-; Contact Material:Beryllium Copper; Contact Termination Type:Surface Mount ;RoHS Compliant: Yes
EMULATION TECHNOLOGY CQ123ENL CHIP QUICK SMD REMOVAL KIT
BGA SOCKET, 352 POSITION, SMD; Product Range:-; Connector Type:BGA Socket; No. of Contacts:352; Pitch Spacing:1.27mm; Row Pitch:1.27mm; Contact Plating:-; Contact Material:Beryllium Copper; Contact Termination Type:Surface Mount ;RoHS Compliant: Yes
HEAT SINK
HEAT SINK
SMD TO PIN OUT ADAPTER - BGA-324; Board Type:PCB, IC to Pin out Adapter; Board Material:Epoxy Glass Composite; Hole Diameter:0.96mm; External Height:74.93mm; External Width:74.93mm; Board Thickness:1.57mm; Product Range:- ;RoHS Compliant: No
BGA SOCKET, 272POS, THROUGH HOLE
BGA SOCKET, 456POS, SMD
BGA SOCKET, 652 POSITION, SMD; Product Range:-; Connector Type:BGA Socket; No. of Contacts:652; Pitch Spacing:1.27mm; Row Pitch:1.27mm; Contact Plating:-; Contact Material:Beryllium Copper; Contact Termination Type:Surface Mount ;RoHS Compliant: Yes
HEAT SINK
HEAT SINK; Packages Cooled:BGA; Thermal Resistance:5.6 C/W; External Height - Metric:7.62mm; External Width - Metric:45mm; External Length - Metric:45mm; External Diameter - Metric:-; Heat Sink Material:-; Product Range:- ;RoHS Compliant: Yes
PLCC SOCKET, 44 POSITION, THROUGH HOLE; Convert From:44-PLCC; Convert To:44-PLCC; Pitch Spacing:2.54mm; Row Pitch:-; Product Range:-; Connector Type:PLCC Socket; No. of Contacts:44; No. of Positions:44 ;RoHS Compliant: No
IC SOCKET TEST CLIP; No. of Contacts:1Contacts; Product Range:-; Lead Length:200mm; Overall Length:233mm ;RoHS Compliant: Yes