Search Results for &quot; M24M01-RCS6TP/A &quot;

IC,SERIAL EEPROM,128KX8,CMOS,BGA,8PIN,PLASTIC

S-PBGA-B8

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Density: 1Mb

Frequency: 1MHz

M95256-RCS6TP/K

IC EEPROM 256K SPI 20MHZ 8WLCSP

Obsolete

Frequency: 20MHz

Max Operating Temperature: 85°C

Memory Size: 256Kb

Memory Type: Non-Volatile, , EEPROM

M95M01-RCS6TP/A

Serial-SPI EEPROM 1M-bit 8-Pin WLCSP 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95160-RCS6TP/S

IC EEPROM 16K SPI 10MHZ 8WLCSP

Volume Production

Access Time-Max: 80ns

Density: 16Kb

Frequency: 5MHz

Interface: SPI, Serial

M95256-RCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RCS6TP/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M01-RMW6TG

1Mb I2C EEPROM, 1MHz, SOIC, 1.8-5.5V

0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-RMN6TP

1Mb I2C EEPROM, 1MHz, SOIC, 5.5V

SOP, SOP8,.25

Active

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-RMN6P

1Mb I2C EEPROM, 400kHz, SOIC, 1.8-5.5V

SOP-8

Active

Access Time: 900ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

+26

M24M01-RMW6G

1Mb I2C EEPROM, 400kHz, 500ns Access, SOIC, 1.8-5.5V

SOP, SOP8,.3

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-DFDW6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-HRMN6P

256KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

+18

M24M01-RDW6TP

1Mbit Serial I2C EEPROM, 1.8-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-DWDW3TP/K

1Mbit Serial I2C EEPROM, 1MHz, 2.5-5.5V, 8-Pin, Automotive

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-HRMN6TP

1Mb I2C EEPROM, 1MHz, SOIC, 5.5V, 500ns Access

SOP, SOP8,.25

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

M24M01-DFCS6TP/K

1-Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PBGA, Industrial

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24M01-DFMN6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO-G8, Industrial

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-DWMN3TP/K

Automotive 1-Mbit serial I<sup>2</sup>C bus EEPROM with 1 MHz clock

SOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-RCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M02-DRCS6TP/K

2Mbit Serial I2C EEPROM, 1.8-5.5V, 85C, R-PBGA-B8

VFBGA, BGA8(UNSPEC)

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

+15

Search Results for "M24M01-RCS6TP/A"

Filters

M24M01-RCS6TP/A

IC,SERIAL EEPROM,128KX8,CMOS,BGA,8PIN,PLASTIC

S-PBGA-B8

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Density: 1Mb

Frequency: 1MHz

M95256-RCS6TP/K

IC EEPROM 256K SPI 20MHZ 8WLCSP

Obsolete

Frequency: 20MHz

Max Operating Temperature: 85°C

Memory Size: 256Kb

Memory Type: Non-Volatile, , EEPROM

M95M01-RCS6TP/A

Serial-SPI EEPROM 1M-bit 8-Pin WLCSP 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95160-RCS6TP/S

IC EEPROM 16K SPI 10MHZ 8WLCSP

Volume Production

Access Time-Max: 80ns

Density: 16Kb

Frequency: 5MHz

Interface: SPI, Serial

M95256-RCS6TP/A

256Kbit EEPROM Serial-SPI WLCSP 8-Pin 2.5-5V

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M95128-RCS6TP/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M01-RMW6TG

1Mb I2C EEPROM, 1MHz, SOIC, 1.8-5.5V

0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-RMN6TP

1Mb I2C EEPROM, 1MHz, SOIC, 5.5V

SOP, SOP8,.25

Active

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-RMN6P

1Mb I2C EEPROM, 400kHz, SOIC, 1.8-5.5V

SOP-8

Active

Access Time: 900ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

+26

M24M01-RMW6G

1Mb I2C EEPROM, 400kHz, 500ns Access, SOIC, 1.8-5.5V

SOP, SOP8,.3

Obsolete

Access Time: 500ns

Access Time-Max: 900ns

Package/Case: SOIC

Density: 1Mb

M24M01-DFDW6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-HRMN6P

256KX8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 0.150 INCH, ROHS COMPLIANT, PLASTIC, SOP-8

SOP, SOP8,.25

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

+18

M24M01-RDW6TP

1Mbit Serial I2C EEPROM, 1.8-5.5V, 8-Pin PDSO

TSSOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-DWDW3TP/K

1Mbit Serial I2C EEPROM, 1MHz, 2.5-5.5V, 8-Pin, Automotive

TSSOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-HRMN6TP

1Mb I2C EEPROM, 1MHz, SOIC, 5.5V, 500ns Access

SOP, SOP8,.25

Obsolete

Access Time: 500ns

Access Time-Max: 500ns

Package/Case: SOIC

Density: 1Mb

M24M01-DFCS6TP/K

1-Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PBGA, Industrial

VFBGA,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: BOTTOM

M24M01-DFMN6TP

1Mbit Serial I2C EEPROM, 1.7-5.5V, 8-Pin PDSO-G8, Industrial

SOP,

Active

Max Operating Temperature: 85

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M24M01-DWMN3TP/K

Automotive 1-Mbit serial I<sup>2</sup>C bus EEPROM with 1 MHz clock

SOP,

Active

Max Operating Temperature: 125

Number of Terminals: 8

Min Operating Temperature: -40

Terminal Position: DUAL

M95128-RCS6TG/K

128Kbit Serial-SPI EEPROM, 8-Pin WLCSP, 2.5-5V

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: WLCSP

Package Description: Wafer Level Chip Scale Package

M24M02-DRCS6TP/K

2Mbit Serial I2C EEPROM, 1.8-5.5V, 85C, R-PBGA-B8