Search Results for &quot; MK40DX256ZVMD10 &quot;

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144

13 X 13 MM, MAPBGA-144

Not Recommended

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

MK40DX256VMD10

32-bit ARM Cortex M4 MCU, 100MHz, 256KB Flash, 144-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

PK40DX256ZVMD10

32-bit ARM Cortex M4 MCU, 256KB Flash, 144-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

Freescale Semiconductor

32-bit MCU, ARM Cortex-M4, 256KB Flash, 100MHz, USB, 144-Pin PBGA

13 X 13 MM, MAPBGA-144

Transferred

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144

13 X 13 MM, MAPBGA-144

Not Recommended

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

MK60DX256ZVMD10

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144

13 X 13 MM, MAPBGA-144

Not Recommended

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

Search Results for "MK40DX256ZVMD10"

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MK40DX256ZVMD10

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144

13 X 13 MM, MAPBGA-144

Not Recommended

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

MK40DX256VMD10

32-bit ARM Cortex M4 MCU, 100MHz, 256KB Flash, 144-Pin MAP-BGA

Ball Grid Array

Active

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

PK40DX256ZVMD10

32-bit ARM Cortex M4 MCU, 256KB Flash, 144-Pin BGA

Ball Grid Array

Obsolete

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: MAP-BGA

Package Description: Molded Array Process Ball Grid Array

Freescale Semiconductor

32-bit MCU, ARM Cortex-M4, 256KB Flash, 100MHz, USB, 144-Pin PBGA

13 X 13 MM, MAPBGA-144

Transferred

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144

13 X 13 MM, MAPBGA-144

Not Recommended

Max Operating Temperature: 105

Number of Terminals: 144

Min Operating Temperature: -40

Terminal Position: BOTTOM

MK60DX256ZVMD10

32-BIT, FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144