Search Results for &quot; MPC7410THX450NE &quot;

1-Core 64b PowerPC Microprocessor, 450MHz, 1.7-1.9V, Surface Mount, -40°C to 105°C

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HCTEBGA-360

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Frequency: 450MHz

Halogen Free: Halogen Free

Freescale Semiconductor

NT HITCE RV1.4

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Transferred

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

32-BIT, 450MHz, RISC PROCESSOR, CBGA360

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

MPC7410THX450LE

RISC Microprocessor

BGA

Obsolete

Max Operating Temperature: 105

Min Operating Temperature: -40

Terminal Position: BOTTOM

JEDEC Package Code: R-PBGA-B

Search Results for "MPC7410THX450NE"

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MPC7410THX450NE

1-Core 64b PowerPC Microprocessor, 450MHz, 1.7-1.9V, Surface Mount, -40°C to 105°C

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HCTEBGA-360

Obsolete

Core Architecture: PowerPC

Data Bus Width: 64b

Frequency: 450MHz

Halogen Free: Halogen Free

Freescale Semiconductor

NT HITCE RV1.4

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Transferred

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

32-BIT, 450MHz, RISC PROCESSOR, CBGA360

25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360

Obsolete

Number of Terminals: 360

Terminal Position: BOTTOM

JEDEC Package Code: S-CBGA-B360

Width: 25

MPC7410THX450LE

RISC Microprocessor