PEB3324EV1.4-G - Electronic Components Search

IC CODEC VOIP 176-LBGA

Obsolete

Package/Case: LBGA

Max Operating Temperature: 85°C

Min Operating Temperature: -40°C

Max Power Dissipation: 400mW

PEB3324EV1.4-G

Volume Production

Package/Case: LBGA

Data Rate: 40Kbps

Packaging: Tray

Radiation Hardening: No

176-Pin LBGA Low-Profile Ball Grid Array IC

Ball Grid Array

Unconfirmed

Basic Package Type: Ball Grid Array

Package Family Name: BGA

Package/Case: LBGA

Package Description: Low Profile Ball Grid Array

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