The 2.4 GHz Wi-Fi and Bluetooth LE MCU module integrates an ESP32-D0WD-V3 dual-core Xtensa LX6 microprocessor with 4 MB Quad SPI flash. It supports 802.11b/g/n Wi-Fi up to 150 Mbps, Bluetooth v4.2 BR/EDR, and Bluetooth LE operation. The module provides up to 26 GPIOs with interfaces including UART, SPI, SDIO, I2C, I2S, ADC, DAC, PWM, touch sensing, and TWAI. It operates from a 3.0 V to 3.6 V supply over a -40 °C to 85 °C ambient range and uses an on-board PCB antenna.
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| Wireless protocol | 2.4 GHz Wi-Fi, Bluetooth BR/EDR, Bluetooth LE |
| Wi-Fi standard | IEEE 802.11b/g/n |
| Wi-Fi data rate | 150 max, 802.11nMbps |
| Bluetooth version | Bluetooth v4.2 BR/EDR and Bluetooth LE |
| Processor core | Xtensa dual-core 32-bit LX6 |
| Maximum CPU clock | 240MHz |
| Flash memory | 4 Quad SPIMB |
| PSRAM | None |
| GPIO count | Up to 26 |
| Antenna | On-board PCB antenna |
| Supply voltage | 3.0 to 3.6V |
| Recommended supply current capability | 0.5 minA |
| Operating ambient temperature | -40 to 85°C |
| Module dimensions | 18.0 x 25.5 x 3.1mm |
| Wi-Fi channel center frequency range | 2412 to 2484MHz |
| Bluetooth LE channel center frequency range | 2402 to 2480MHz |
| Interfaces | SD card, UART, SPI, SDIO, I2C, LED PWM, Motor PWM, I2S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC, TWAI |
| RoHS | Compliant |
| REACH | Compliant |
| Bluetooth Qualification | BQB certified |
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