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Technical Specifications
Infineon BSP550 E6327 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOT-223 |
| Package/Case | SOT-223 |
| Package Description | Small Outline Transistor |
| Lead Shape | Gull-wing |
| Pin Count | 4 |
| PCB | 3 |
| Tab | Tab |
| Package Length (mm) | 6.5 |
| Package Width (mm) | 3.5 |
| Package Height (mm) | 1.6 |
| Seated Plane Height (mm) | 1.8(Max) |
| Pin Pitch (mm) | 2.3 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | TO-261AA |
Compliance
| Cage Code | CG091 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Datasheet
Infineon BSP550 E6327 Datasheet
Download the complete datasheet for Infineon BSP550 E6327 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.