PackageTSSLP
Capacitance0.6pF
MountingSurface Mount
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Technical Specifications
Infineon ESD18VU1B-02LS technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
TSSLP
Package/Case
TSSLP
Lead Shape
No Lead
Pin Count
2
PCB
2
Package Length (mm)
0.62
Package Width (mm)
0.32
Package Height (mm)
0.27(Max)
Seated Plane Height (mm)
0.31
Pin Pitch (mm)
0.36
Package Material
Plastic
Mounting
Surface Mount
Configuration
Single
Type
TVS
Direction Type
Bi-Directional
Maximum Working Voltage
18.5V
Maximum Clamping Voltage
34(Typ)V
Maximum Leakage Current
1000uA
Capacitance
0.6pF
Number of Elements per Chip
1
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
CG091
EU RoHS
Yes
HTS Code
8536308000
Schedule B
8536300000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2002/95/EC
Datasheet
Infineon ESD18VU1B-02LS Datasheet
Download the complete datasheet for Infineon ESD18VU1B-02LS to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.