The ICE3B0565JGXUMA1 is a surface mount power management IC available in a 12-pin dual small outline package. It features a lead-frame SMT basic package type with a plastic package material. The seated plane height is 1.75mm maximum, and the pin pitch is 1.27mm. This IC is suitable for use in AC/DC converters and offline switchers.
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Infineon ICE3B0565JGXUMA1 technical specifications.
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | DSO |
| Package Description | Dual Small Outline |
| Lead Shape | Gull-wing |
| Pin Count | 12 |
| PCB | 12 |
| Package Length (mm) | 10 |
| Package Width (mm) | 4 |
| Package Height (mm) | 1.5 |
| Seated Plane Height (mm) | 1.75(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Cage Code | CG091 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for Infineon ICE3B0565JGXUMA1 to view detailed technical specifications.
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