16-bit/32-bit Microcontroller Unit (MCU) featuring a C166SV2 core with CISC, DSP, and RISC instruction set architectures. Operates at a maximum clock rate of 66 MHz, offering 320KB of Flash program memory and 42KB of RAM. This surface-mount device is housed in a 100-pin LQFP EP package with a 0.5mm pin pitch, supporting dual ADCs and multiple interfaces including CAN, I2C, SPI, and UART. Designed for operation between -40°C and 85°C with supply voltages from 3.3V to 5.5V.
PackageLQFP EP
MountingSurface Mount
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Technical Specifications
Infineon SAF-XC2263N-40F66L technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP EP
Package Description
Low Profile Quad Flat Package, Exposed Pad
Lead Shape
Gull-wing
Pin Count
100
PCB
100
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
1.4
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-204AD
Family Name
XC2000
Data Bus Width
16|32bit
Instruction Set Architecture
CISC|DSP|RISC
Maximum Clock Rate
66MHz
Maximum CPU Frequency
66MHz
Device Core
C166SV2
Program Memory Type
Flash
Program Memory Size
320KB
RAM Size
42KB
Number of Programmable I/Os
76
Core Architecture
C166
Programmability
Yes
Number of Timers
5
Interface Type
CAN/I2C/SPI/UART
CAN
1
I2C
1
SPI
1
Ethernet
0
UART
1
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
5/5
Number of ADCs
Dual
Compliance
Cage Code
CG091
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
Datasheet
Infineon SAF-XC2263N-40F66L Datasheet
Download the complete datasheet for Infineon SAF-XC2263N-40F66L to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.