The TLE7263EXUMA1 is a power management IC with a lead-frame SMT package in a dual small outline case. It has 36 pins and a seated plane height of 2.65mm maximum. The IC is designed for surface mount and has a package weight of 0.6g. It operates between -40°C and 150°C. The TLE7263EXUMA1 is manufactured by Infineon.
PackageDSO
MountingSurface Mount
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Technical Specifications
Infineon TLE7263EXUMA1 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | DSO |
| Package Description | Dual Small Outline |
| Lead Shape | Gull-wing |
| Pin Count | 36 |
| PCB | 36 |
| Package Length (mm) | 12.8 |
| Package Width (mm) | 7.6 |
| Package Height (mm) | 2.45 |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Weight (g) | 0.6 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 150°C |
Compliance
| Cage Code | CG091 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU |
Datasheet
Infineon TLE7263EXUMA1 Datasheet
Download the complete datasheet for Infineon TLE7263EXUMA1 to view detailed technical specifications.
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