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Technical Specifications
Infineon TLE8262EXUMA1 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | DSO EP |
| Package Description | Dual Small Outline, Exposed Pad |
| Lead Shape | Gull-wing |
| Pin Count | 36 |
| PCB | 36 |
| Package Length (mm) | 12.8 |
| Package Width (mm) | 7.6 |
| Package Height (mm) | 2.45 |
| Seated Plane Height (mm) | 2.55(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Weight (g) | 0.59 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Category | System Basis Chip |
| Maximum Data Rate | 1MBd |
| Max Operating Supply Voltage | 28V |
| Min Operating Supply Voltage | 5.5V |
| Power Supply Type | Analog |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 150°C |
| Typical Operating Supply Voltage | 9|12|15|18|24|28V |
Compliance
| Cage Code | CG091 |
| EU RoHS | Yes |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU |
Datasheet
Infineon TLE8262EXUMA1 Datasheet
Download the complete datasheet for Infineon TLE8262EXUMA1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.