16Mbit SDRAM chip, organized as 1Mx16, featuring a 16-bit data bus width and 12-bit address bus. Operates at a maximum clock rate of 133 MHz with two internal banks, each containing 512K words. This surface-mount component is housed in a 60-pin Mini-FBGA package with a 0.65mm pin pitch, measuring 10.1mm x 6.4mm x 0.87mm. It functions with a typical operating supply voltage of 1.8V, a maximum operating current of 60mA, and a temperature range of 0°C to 70°C.
PackageMini-FBGA
MountingSurface Mount
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Technical Specifications
Integrated Silicon Solution IS42S16100F-75BL technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
Mini-FBGA
Package Description
Mini Ball Grid Array Package
Lead Shape
Ball
Pin Count
60
PCB
60
Package Length (mm)
10.1
Package Width (mm)
6.4
Package Height (mm)
0.87(Max)
Seated Plane Height (mm)
1.2(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Density
16Mbit
Type
SDRAM
Organization
1Mx16
Data Bus Width
16bit
Maximum Clock Rate
133MHz
Number of Internal Banks
2
Number of Words per Bank
512K
Maximum Access Time
8|6ns
Density in Bits
16777216bit
Address Bus Width
12bit
Maximum Operating Current
60mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.9V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Compliance
Cage Code
1J9V2
EU RoHS
Yes
HTS Code
8542320002
Schedule B
8542320015
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Integrated Silicon Solution IS42S16100F-75BL Datasheet
Download the complete datasheet for Integrated Silicon Solution IS42S16100F-75BL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.