16Mbit SDRAM chip, 1Mx16 organization, offering a 16-bit data bus width and a maximum clock rate of 133 MHz. This surface-mount component features a 60-pin TFBGA package with a 0.65mm pin pitch, measuring 10.1mm x 6.4mm x 0.85mm. Operating at a typical 1.8V supply voltage, it provides 2 internal banks, each with 512K words, and a maximum access time of 6ns. Extended temperature range from -40°C to 85°C.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | TFBGA |
| Package Description | Thin Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 60 |
| PCB | 60 |
| Package Length (mm) | 10.1 |
| Package Width (mm) | 6.4 |
| Package Height (mm) | 0.85(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Density | 16Mbit |
| Type | SDRAM |
| Organization | 1Mx16 |
| Data Bus Width | 16bit |
| Maximum Clock Rate | 133MHz |
| Number of Internal Banks | 2 |
| Number of Words per Bank | 512K |
| Maximum Access Time | 8|6ns |
| Density in Bits | 16777216bit |
| Address Bus Width | 12bit |
| Maximum Operating Current | 60mA |
| Typical Operating Supply Voltage | 1.8V |
| Max Operating Supply Voltage | 1.9V |
| Min Operating Supply Voltage | 1.7V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Cage Code | 1J9V2 |
| EU RoHS | Yes |
| HTS Code | 8542320002 |
| Schedule B | 8542320015 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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