Automotive-grade 512Mbit DDR SDRAM memory chip, organized as 16Mx32, featuring a 32-bit data bus and a maximum clock rate of 133 MHz. This surface-mount component utilizes a 90-pin Thin Fine Pitch Ball Grid Array (TFBGA) package with a 13mm x 8mm footprint and 0.8mm maximum height. Operating at a typical 1.8V supply voltage, it offers a maximum access time of 6ns and supports 4 internal banks with 4M words per bank. Designed for demanding environments, it operates across a temperature range of -40°C to 85°C.
PackageTFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Integrated Silicon Solution IS46LR32160B-75BLA1 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
90
PCB
90
Package Length (mm)
13
Package Width (mm)
8
Package Height (mm)
0.8(Max)
Seated Plane Height (mm)
1.2(Max)
Package Material
Plastic
Mounting
Surface Mount
Density
512Mbit
Type
DDR SDRAM
Organization
16Mx32
Data Bus Width
32bit
Maximum Clock Rate
133MHz
Number of Internal Banks
4
Number of Words per Bank
4M
Maximum Access Time
8|6ns
Density in Bits
536870912bit
Address Bus Width
15bit
Maximum Operating Current
110mA
Typical Operating Supply Voltage
1.8V
Max Operating Supply Voltage
1.95V
Min Operating Supply Voltage
1.7V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
1J9V2
EU RoHS
Yes
HTS Code
8542320028
Schedule B
8542320015
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
PPAP
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Integrated Silicon Solution IS46LR32160B-75BLA1 Datasheet
Download the complete datasheet for Integrated Silicon Solution IS46LR32160B-75BLA1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.