Integrated Silicon Solution
IS61NLP25636A-200B3I
ZBT SRAM, 256KX36, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165
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Technical Specifications
Integrated Silicon Solution IS61NLP25636A-200B3I technical specifications.
General
Max Operating Temperature
85
Number of Terminals
165
Min Operating Temperature
-40
Terminal Position
BOTTOM
JEDEC Package Code
R-PBGA-B165
Width
13
Length
15
Pin Count
165
Number of Functions
1
Temperature Grade
INDUSTRIAL
Supply Voltage-Nom (Vsup)
3.3
Supply Voltage-Max (Vsup)
3.465
Supply Voltage-Min (Vsup)
3.135
Supply Current-Max
0.28
Number of Words
262144
Number of Words Code
256000
Memory IC Type
ZBT SRAM
Parallel/Serial
PARALLEL
Standby Current-Max
0.05
Access Time-Max
3.1
Clock Frequency-Max (fCLK)
200
I/O Type
COMMON
Compliance
RoHS
No
Eccn Code
3A991.B.2.A
Lead Free
No
HTS Code
8542.32.00.41
REACH
Compliant
Military Spec
False
Datasheet
Integrated Silicon Solution IS61NLP25636A-200B3I Datasheet
Download the complete datasheet for Integrated Silicon Solution IS61NLP25636A-200B3I to view detailed technical specifications.
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