PackageFBGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Intel 5ASXFB3G4F35I3N technical specifications.
General
| Package/Case | FBGA |
| Core Architecture | ARM |
| Data Rate | 6.375Gbps |
| Interface | I2C, SPI, USB, Ethernet, MMC, SDIO, SD, UART, USART, EBI/EMI |
| Max Operating Temperature | 100°C |
| Memory Size | 19302KB |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of I/Os | 350 |
| Number of Logic Blocks (LABs) | 132075 |
| Number of Logic Elements/Cells | 350000 |
| Number of Transceivers | 18 |
| Operating Supply Voltage | 1.1V |
| Package Quantity | 1 |
| Packaging | Tray |
| Peripherals | POR, WDT, DMA |
| RAM Size | 19767296b |
| RoHS Compliant | Yes |
| Series | Arria V SX |
Compliance
| RoHS | Compliant |
Datasheet
Intel 5ASXFB3G4F35I3N Datasheet
Download the complete datasheet for Intel 5ASXFB3G4F35I3N to view detailed technical specifications.
No datasheet is available for this part.
Product Images
