5SGSMD5H2F35I2N

This Field Programmable Gate Array (FPGA) offers 457,000 logic cells and 690,000 registers, built on 28nm process technology. It features 1152 pins in a 35x35mm Flip Chip Fine Pitch Ball Grid Array (FC-FBGA) package for surface mounting. Key capabilities include 552 user I/Os, 39936 Kbit of RAM, 1590 dedicated DSP blocks, and 36 transceiver blocks operating at up to 14.1 Gbps. The device supports multiple external memory interfaces, including DDR2/3 SDRAM and RLDRAM II/III, and integrates 2 Ethernet MACs. Operating temperature range is -40°C to 100°C.