64-bit, 45nm, 3GHz, 4-core microprocessor featuring a 771-pin FCLGA package. This surface-mount device offers a 32KB instruction cache and 32KB data cache, with a maximum operating supply voltage range of 1.155V to 1.605V. The Flip-Chip Land Grid Array package measures 37.55mm square with a seated plane height of 4.32mm.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel AT80574KJ080N SLBBM technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
771
PCB
771
Package Length (mm)
37.55(Max)
Package Width (mm)
37.55(Max)
Package Height (mm)
4.32(Max)
Seated Plane Height (mm)
4.32(Max)
Pin Pitch (mm)
1.09|1.17
Package Material
Plastic
Mounting
Surface Mount
Family Name
Xeon® Processor E5450
Data Bus Width
64bit
Device Core
Xeon
Maximum Speed
3000MHz
Process Technology
45nm
Number of CPU Cores
4
Interface Type
PECI
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.155|1.35|1.605V
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel AT80574KJ080N SLBBM Datasheet
Download the complete datasheet for Intel AT80574KJ080N SLBBM to view detailed technical specifications.
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