64-bit, 4-core microprocessor operating at 3.33GHz, built on 45nm process technology. Features a 771-pin Flip-Chip Land Grid Array (FCLGA) package with surface mount capability. Includes 32KB instruction cache and 32KB data cache. Supports PECI interface.
Checking distributor stock and pricing after the page loads.
Sign in to ask questions about the Intel AT80574KJ093N SLBBF datasheet using AI. Get instant answers about specifications, features, and technical details, ideal for finding information in larger documents.
Sign In to ChatWidest selection of semiconductors and electronic components in stock and ready to ship ™
Intel AT80574KJ093N SLBBF technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | FCLGA |
| Package Description | Flip-Chip Land Grid Array |
| Lead Shape | No Lead |
| Pin Count | 771 |
| PCB | 771 |
| Package Length (mm) | 37.55(Max) |
| Package Width (mm) | 37.55(Max) |
| Package Height (mm) | 4.32(Max) |
| Seated Plane Height (mm) | 4.32(Max) |
| Pin Pitch (mm) | 1.09|1.17 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Xeon® Processor X5470 |
| Data Bus Width | 64bit |
| Device Core | Xeon |
| Maximum Speed | 3330MHz |
| Process Technology | 45nm |
| Number of CPU Cores | 4 |
| Interface Type | PECI |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.155|1.35|1.605V |
| Instruction Cache Size | 32KB |
| Data Cache Size | 32KB |
| Multiply Accumulate | No |
| Cage Code | 4BA62 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for Intel AT80574KJ093N SLBBF to view detailed technical specifications.
The embedded preview will load automatically when this section scrolls into view.
