64-bit microprocessor featuring a 45nm process technology and a maximum speed of 3.2GHz. This quad-core processor utilizes a Flip-Chip Land Grid Array (FCLGA) package with 771 pins, designed for surface mounting. The package dimensions are a maximum of 37.55mm in length and width, and 4.34mm in height. It supports a 64-bit data bus and includes a PECI interface.
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Intel AT80574KL088NT SLBBG technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | FCLGA |
| Package Description | Flip-Chip Land Grid Array |
| Lead Shape | No Lead |
| Pin Count | 771 |
| PCB | 771 |
| Package Length (mm) | 37.55(Max) |
| Package Width (mm) | 37.55(Max) |
| Package Height (mm) | 4.34(Max) |
| Mounting | Surface Mount |
| Family Name | Xeon® Processor X5482 |
| Data Bus Width | 64bit |
| Device Core | Xeon |
| Maximum Speed | 3200MHz |
| Process Technology | 45nm |
| Number of CPU Cores | 4 |
| Interface Type | PECI |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Multiply Accumulate | No |
| Cage Code | 4BA62 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
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