64-bit RISC microprocessor featuring a 32nm process technology and a maximum speed of 2.13GHz. This LGA package, with 1567 pins and surface mount capability, offers 10 CPU cores and a 1.0875V operating voltage. It includes a PECI interface and is built on a plastic Land Grid Array package.
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| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | LGA |
| Package Description | Land Grid Array Package |
| Lead Shape | No Lead |
| Pin Count | 1567 |
| PCB | 1567 |
| Package Length (mm) | 56.47 |
| Package Width (mm) | 49.17 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Xeon® Processor X5675 |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Xeon |
| Maximum Speed | 2130MHz |
| Process Technology | 32nm |
| Number of CPU Cores | 10 |
| Interface Type | PECI |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.35V |
| Multiply Accumulate | No |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
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