64-bit RISC microprocessor featuring a single Atom™ core operating at 1.6GHz. This 45nm process technology component utilizes a 437-pin Flip Chip Ball Grid Array (FCBGA) package for surface mounting. Key specifications include a 32KB instruction cache and 24KB data cache, with a maximum operating supply voltage of 1.575V.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 437 |
| PCB | 437 |
| Package Length (mm) | 22.05(Max) |
| Package Width (mm) | 22.05(Max) |
| Package Height (mm) | 1.42(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Atom™ Processor 230 |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Atom |
| Maximum Speed | 1600MHz |
| Process Technology | 45nm |
| Number of CPU Cores | 1 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.575V |
| Instruction Cache Size | 32KB |
| Data Cache Size | 24KB |
| Multiply Accumulate | No |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
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