64-bit RISC microprocessor featuring a 22nm process technology and a maximum speed of 1700 MHz. This Flip Chip Ball Grid Array (FCBGA) package offers 1023 pins for surface mounting, with a 31mm x 24mm plastic package. It includes 2 CPU cores and supports DMI/PECI interface types.
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| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1023 |
| PCB | 1023 |
| Package Length (mm) | 31 |
| Package Width (mm) | 24 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Core™ i7-3517UE Processor |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Core i7 |
| Maximum Speed | 1700MHz |
| Process Technology | 22nm |
| Number of CPU Cores | 2 |
| Interface Type | DMI/PECI |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Multiply Accumulate | No |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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