64-bit 4-core microprocessor featuring a 2.33GHz clock speed and 45nm process technology. This Flip-Chip Land Grid Array (FCLGA) package offers 771 pins with a 37.55mm maximum dimensions and 4.32mm seated plane height, designed for surface mounting. It includes 32KB instruction and 32KB data cache, with a maximum operating supply voltage range of 1.155V to 1.605V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel BX80574L5410P SLAP4 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
771
PCB
771
Package Length (mm)
37.55(Max)
Package Width (mm)
37.55(Max)
Package Height (mm)
4.32(Max)
Seated Plane Height (mm)
4.32(Max)
Pin Pitch (mm)
1.09|1.17
Package Material
Plastic
Mounting
Surface Mount
Family Name
Xeon® Processor L5410
Data Bus Width
64bit
Device Core
Xeon
Maximum Speed
2330MHz
Process Technology
45nm
Number of CPU Cores
4
Interface Type
PECI
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.155|1.35|1.605V
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel BX80574L5410P SLAP4 Datasheet
Download the complete datasheet for Intel BX80574L5410P SLAP4 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.