64-bit RISC microprocessor featuring a 45nm process technology and a maximum speed of 3.06GHz. This 4-core processor utilizes a Flip-Chip Land Grid Array (FCLGA) package with 1366 pins, designed for surface mounting. The FCLGA package measures 45.07mm (Max) in length, 42.57mm (Max) in width, and 4.87mm (Max) in height. Maximum operating supply voltage is 1.375V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel BX80601950 S LBEN technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
1366
PCB
1366
Package Length (mm)
45.07(Max)
Package Width (mm)
42.57(Max)
Package Height (mm)
4.87(Max)
Package Material
Plastic
Mounting
Surface Mount
Family Name
Core™ i7-950 Processor
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Core i7
Maximum Speed
3060MHz
Process Technology
45nm
Core Architecture
i7
Number of CPU Cores
4
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.375V
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.1
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
Intel BX80601950 S LBEN Datasheet
Download the complete datasheet for Intel BX80601950 S LBEN to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.