The BX80602X5550 S LBF5 is a 1366-pin flip-chip land grid array Xeon processor with a maximum speed of 2660. It features a 45nm process technology and a 64-bit data bus width. The processor is designed for surface mount and has a package length of 45.07mm, width of 42.57mm, and height of 4.87mm. It is made of plastic and has a non-lead frame SMT package type.
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Intel BX80602X5550 S LBF5 technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | FCLGA |
| Package Description | Flip-Chip Land Grid Array |
| Lead Shape | No Lead |
| Pin Count | 1366 |
| PCB | 1366 |
| Package Length (mm) | 45.07(Max) |
| Package Width (mm) | 42.57(Max) |
| Package Height (mm) | 4.87(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Xeon® Processor |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Xeon |
| Maximum Speed | 2660MHz |
| Process Technology | 45nm |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU |
Download the complete datasheet for Intel BX80602X5550 S LBF5 to view detailed technical specifications.
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