64-bit RISC microprocessor featuring a Core™ i7-870 processor device core. Operates at a maximum speed of 2930 MHz with a 45nm process technology. This surface mount component utilizes a Flip-Chip Land Grid Array (FCLGA) package with 1156 pins and a 37.5mm x 37.5mm footprint. It includes 4 CPU cores and has a maximum operating supply voltage of 1.4V.
PackageFCLGA
MountingSurface Mount
Quick Jump:
Technical Specifications
Intel BX80605I7870 SLBJG technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
1156
PCB
1156
Package Length (mm)
37.5
Package Width (mm)
37.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
Core™ i7-870 Processor
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Core i7
Maximum Speed
2930MHz
Process Technology
45nm
Number of CPU Cores
4
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.4V
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Intel BX80605I7870 SLBJG Datasheet
Download the complete datasheet for Intel BX80605I7870 SLBJG to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.