64-bit RISC microprocessor featuring a Core™ i7-870 processor device core. Operates at a maximum speed of 2930 MHz with a 45nm process technology. This surface mount component utilizes a Flip-Chip Land Grid Array (FCLGA) package with 1156 pins and a 37.5mm x 37.5mm footprint. It includes 4 CPU cores and has a maximum operating supply voltage of 1.4V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel BX80605I7870 SLBJG technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | FCLGA |
| Package Description | Flip-Chip Land Grid Array |
| Lead Shape | No Lead |
| Pin Count | 1156 |
| PCB | 1156 |
| Package Length (mm) | 37.5 |
| Package Width (mm) | 37.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Core™ i7-870 Processor |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Core i7 |
| Maximum Speed | 2930MHz |
| Process Technology | 45nm |
| Number of CPU Cores | 4 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.4V |
| Multiply Accumulate | No |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Intel BX80605I7870 SLBJG Datasheet
Download the complete datasheet for Intel BX80605I7870 SLBJG to view detailed technical specifications.
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