64-bit RISC microprocessor featuring a 3.3GHz clock speed and 6 CPU cores. This processor utilizes a 32nm process technology and is housed in a 2011-pin FCLGA package with a surface mount configuration. The Flip-Chip Land Grid Array package measures 52.5mm x 45mm and operates at a maximum supply voltage of 1.35V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel BX80621E51660 SR0KN technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
2011
PCB
2011
Package Length (mm)
52.5
Package Width (mm)
45
Package Material
Plastic
Mounting
Surface Mount
Family Name
Xeon® Processor E5-1660
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Xeon
Maximum Speed
3300MHz
Process Technology
32nm
Number of CPU Cores
6
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.35V
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992.c
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Intel BX80621E51660 SR0KN Datasheet
Download the complete datasheet for Intel BX80621E51660 SR0KN to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.