64-bit RISC microprocessor featuring a 32nm process technology and a 3.1GHz maximum speed. This Flip-Chip Land Grid Array (FCLGA) package, with 1155 pins and surface mount capability, houses a 2-core architecture. The device operates within a maximum temperature of 69.1°C.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel BX80623I32102 SR05D technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
1155
PCB
1155
Package Length (mm)
37.5
Package Width (mm)
37.5
Package Material
Plastic
Mounting
Surface Mount
Family Name
Core™ i3-2102 Processor
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Core i3
Maximum Speed
3100MHz
Process Technology
32nm
Core Architecture
i3
Number of CPU Cores
2
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Temperature
69.1°C
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Intel BX80623I32102 SR05D Datasheet
Download the complete datasheet for Intel BX80623I32102 SR05D to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.