64-bit RISC microprocessor featuring a 32nm process technology and a 3.1GHz maximum speed. This Flip-Chip Land Grid Array (FCLGA) package, with 1155 pins and surface mount capability, houses a 2-core architecture. The device operates within a maximum temperature of 69.1°C.
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| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | FCLGA |
| Package Description | Flip-Chip Land Grid Array |
| Lead Shape | No Lead |
| Pin Count | 1155 |
| PCB | 1155 |
| Package Length (mm) | 37.5 |
| Package Width (mm) | 37.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Core™ i3-2102 Processor |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Core i3 |
| Maximum Speed | 3100MHz |
| Process Technology | 32nm |
| Core Architecture | i3 |
| Number of CPU Cores | 2 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Temperature | 69.1°C |
| Multiply Accumulate | No |
| Cage Code | 4BA62 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
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