64-bit RISC microprocessor featuring 4 cores and a maximum speed of 3200 MHz. Built on 22nm process technology, this Flip-Chip Land Grid Array (FCLGA) package offers 1155 pins for surface mounting. Includes 32KB instruction cache and 32KB data cache, with DMI/PECI interface type.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel BX80637E31225V2 SR0PJ technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
1155
PCB
1155
Package Material
Plastic
Mounting
Surface Mount
Family Name
Xeon® Processor E3-1225
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Xeon
Maximum Speed
3200MHz
Process Technology
22nm
Number of CPU Cores
4
Interface Type
DMI/PECI
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.86V
Instruction Cache Size
32KB
Data Cache Size
32KB
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes with Exemption
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992.c
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Intel BX80637E31225V2 SR0PJ Datasheet
Download the complete datasheet for Intel BX80637E31225V2 SR0PJ to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.