64-bit RISC microprocessor featuring 4 cores and a maximum speed of 3200 MHz. Built on 22nm process technology, this Flip-Chip Land Grid Array (FCLGA) package offers 1155 pins for surface mounting. Includes 32KB instruction cache and 32KB data cache, with DMI/PECI interface type.
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Intel BX80637E31225V2 SR0PJ technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | FCLGA |
| Package Description | Flip-Chip Land Grid Array |
| Lead Shape | No Lead |
| Pin Count | 1155 |
| PCB | 1155 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Xeon® Processor E3-1225 |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Xeon |
| Maximum Speed | 3200MHz |
| Process Technology | 22nm |
| Number of CPU Cores | 4 |
| Interface Type | DMI/PECI |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.86V |
| Instruction Cache Size | 32KB |
| Data Cache Size | 32KB |
| Multiply Accumulate | No |
| Cage Code | 4BA62 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
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