64-bit RISC microprocessor featuring a 3GHz clock speed and 2 CPU cores. This Flip-Chip Land Grid Array (FCLGA) package, with a 2011-pin count and surface mount configuration, utilizes 32nm process technology. It operates at a maximum supply voltage of 1.35V and is housed in a plastic package measuring 52.5mm x 45mm.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel CM8062101143202 SR0LE technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
2011
PCB
2011
Package Length (mm)
52.5
Package Width (mm)
45
Package Material
Plastic
Mounting
Surface Mount
Family Name
Xeon® Processor E5-2637
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Xeon
Maximum Speed
3000MHz
Process Technology
32nm
Number of CPU Cores
2
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.35V
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992.c
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
Intel CM8062101143202 SR0LE Datasheet
Download the complete datasheet for Intel CM8062101143202 SR0LE to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.