64-bit RISC microprocessor featuring a 3GHz clock speed and 2 CPU cores. This Flip-Chip Land Grid Array (FCLGA) package, with a 2011-pin count and surface mount configuration, utilizes 32nm process technology. It operates at a maximum supply voltage of 1.35V and is housed in a plastic package measuring 52.5mm x 45mm.
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Intel CM8062101143202 SR0LE technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | LGA |
| Package/Case | FCLGA |
| Package Description | Flip-Chip Land Grid Array |
| Lead Shape | No Lead |
| Pin Count | 2011 |
| PCB | 2011 |
| Package Length (mm) | 52.5 |
| Package Width (mm) | 45 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Xeon® Processor E5-2637 |
| Data Bus Width | 64bit |
| Instruction Set Architecture | RISC |
| Device Core | Xeon |
| Maximum Speed | 3000MHz |
| Process Technology | 32nm |
| Number of CPU Cores | 2 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.35V |
| Multiply Accumulate | No |
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 5A992.c |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
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