64-bit RISC microprocessor featuring 8 CPU cores and a maximum speed of 2.2GHz. This surface-mount device utilizes 32nm process technology and is housed in a 2011-pin FCLGA package with a plastic material. The Flip-Chip Land Grid Array package measures 52.5mm in length and 45mm in width, with a maximum operating supply voltage of 1.35V.
PackageFCLGA
MountingSurface Mount
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Technical Specifications
Intel CM8062107184801 SR0KK technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
LGA
Package/Case
FCLGA
Package Description
Flip-Chip Land Grid Array
Lead Shape
No Lead
Pin Count
2011
PCB
2011
Package Length (mm)
52.5
Package Width (mm)
45
Package Material
Plastic
Mounting
Surface Mount
Family Name
Xeon® Processor E5-2660
Data Bus Width
64bit
Instruction Set Architecture
RISC
Device Core
Xeon
Maximum Speed
2200MHz
Process Technology
32nm
Number of CPU Cores
8
CAN
0
UART
0
USART
0
I2C
0
SPI
0
USB
0
Ethernet
0
I2S
0
Max Operating Supply Voltage
1.35V
Multiply Accumulate
No
Compliance
Cage Code
4BA62
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A992.c
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
Intel CM8062107184801 SR0KK Datasheet
Download the complete datasheet for Intel CM8062107184801 SR0KK to view detailed technical specifications.
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