32-bit RISC microprocessor featuring a single Atom core, operating at a maximum speed of 1.6GHz with 45nm process technology. This Flip Chip Ball Grid Array (FCBGA) package offers 676 pins with a 0.8mm pitch, designed for surface mounting. Integrated interfaces include CAN, I2C, SPI, and UART, with a maximum operating supply voltage of 1.1V. The device operates within a temperature range of -40°C to 85°C, boasting 32KB instruction cache and 24KB data cache.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Intel CT80618007035AB SLH95 technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 676 |
| PCB | 676 |
| Package Length (mm) | 22.05(Max) |
| Package Width (mm) | 22.05(Max) |
| Package Height (mm) | 1.83(Max) |
| Seated Plane Height (mm) | 2.35(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Atom™ Processor E680T |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | Atom |
| Maximum Speed | 1600MHz |
| Process Technology | 45nm |
| Number of CPU Cores | 1 |
| Interface Type | CAN/I2C/SPI/UART |
| CAN | 1 |
| UART | 1 |
| USART | 0 |
| I2C | 1 |
| SPI | 1 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 1.1V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Instruction Cache Size | 32KB |
| Data Cache Size | 24KB |
| Multiply Accumulate | No |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.1 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Intel CT80618007035AB SLH95 Datasheet
Download the complete datasheet for Intel CT80618007035AB SLH95 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.