32-bit RISC microprocessor featuring a single Atom core operating at a maximum speed of 1000 MHz, manufactured using 45nm process technology. This Flip Chip Ball Grid Array (FCBGA) package offers 1466 pins for surface mounting, with dimensions of 37.5mm x 37.5mm. The component utilizes a Ball Grid Array package family with ball leads and a plastic package material.
PackageFCBGA
MountingSurface Mount
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Technical Specifications
Intel CY80632007221AA SLJBX technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | FCBGA |
| Package Description | Flip Chip Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 1466 |
| PCB | 1466 |
| Package Length (mm) | 37.5 |
| Package Width (mm) | 37.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | Atom™ Processor E645CT |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Device Core | Atom |
| Maximum Speed | 1000MHz |
| Process Technology | 45nm |
| Number of CPU Cores | 1 |
| CAN | 0 |
| UART | 0 |
| USART | 0 |
| I2C | 0 |
| SPI | 0 |
| USB | 0 |
| Ethernet | 0 |
| I2S | 0 |
| Multiply Accumulate | No |
Compliance
| Cage Code | 4BA62 |
| EU RoHS | Yes with Exemption |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A001.a.7.a |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU |
Datasheet
Intel CY80632007221AA SLJBX Datasheet
Download the complete datasheet for Intel CY80632007221AA SLJBX to view detailed technical specifications.
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