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Technical Specifications
Intel EP2AGX65DF29I3 technical specifications.
General
Package/Case
FBGA
Max Operating Temperature
100°C
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
364
Number of Logic Blocks (LABs)
2530
Number of Logic Elements/Cells
60214
Packaging
Tray
RAM Size
5371904b
RoHS Compliant
No
Series
Arria II GX
Compliance
RoHS
Not Compliant
Datasheet
Intel EP2AGX65DF29I3 Datasheet
Download the complete datasheet for Intel EP2AGX65DF29I3 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.